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Product Information

Photolithography.com offers spin coaters, mask aligners, developing equipment, and etching equipment for laboratory applications.

Resist Coating images Exposure images Development images Etching
<Maximum Substrate Size>        <Maximum Substrate Size>    
4 in.
6 in.
8 in.
12 in.
MS-B100
MS-B150
MS-B200
MS-B300
  100 × 100 mm
150 × 150 mm
MS-B200 (Shield type)
MS-B300 (Shield type)
  ●Sample Stages (standard)
●Sample Stages (customized)

Spin Coaters

MS-B100 Spin Coater

[Model suitable for 4-inch-dia. wafers and 75 × 75 mm substrates]

MS-B100 Spin Coater

Product Specifications

Maximum substrate size4-inch-dia. wafers or 75 × 75 mm substrates
Rotational speed (rpm)20 to 8,000
Rotational accuracy±1 rpm (under load)
MotorAC servomotor
CoverAcrylic
Inside diameter of spinning chamber220 mm dia.
Numbers of steps and patterns100 steps × 10 patterns
Time setting 999.9 sec
Safety interlockVacuum (included as standard)
Cover (optional)
Dripping equipmentCannot be attached.
Working vacuum pressure-0.08 to -0.1 MPa
Power supply100 to 240 V AC, 5 A
Outside dimensions (mm) 259 W × 246 H × 330 D
Weight 10 kg

Note: Specifications are subject to change without notice.

Coating Thickness Distribution Data

Coating Thickness Distribution Data

↑Click Zoom

Model usedMS-B100
Coating thickness measurement systemF50 (from Filmetrics)
ResistOFPR-800LB (from Tokyo Ohka Kogyo Co., Ltd.)
Substrate size4-inch-dia. silicon wafers
Target coating thickness 1 μm
Coating thickness distribution±0.8%
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MS-B150 Spin Coater

[Model suitable for 6-inch-dia. wafers and 100 × 100 mm substrates]

MS-B150 Spin Coater

Product Specifications

Maximum substrate size 6-inch-dia. wafers or 100 × 100 mm substrates
Rotational speed (rpm) 20 to 7,000
Rotational accuracy ±1 rpm (under load)
Motor AC servomotor
Cover Acrylic
Inside diameter of spinning chamber 290 mm dia.
Numbers of steps and patterns 100 steps × 10 patterns
Time setting 999.9 sec
Safety interlock Vacuum (included as standard)
Cover (optional)
Dripping equipment Optional
Working vacuum pressure -0.08 to -0.1 MPa
Power supply 100 to 240 V AC, 5 A
Outside dimensions (mm) 352 W × 303 H × 432 D
Weight 16 kg

Note: Specifications are subject to change without notice.

Coating Thickness Distribution Data

Coating Thickness Distribution Data

↑Click Zoom

Model used MS-B150
Coating thickness measurement system F50 (from Filmetrics)
Resist OFPR-800LB (from Tokyo Ohka Kogyo Co., Ltd.)
Substrate size 6-inch-dia. silicon wafers
Target coating thickness 1 μm
Coating thickness distribution ±0.6%
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MS-B200 Spin Coater

[Model suitable for 8-inch-dia. wafers and 150 × 150 mm substrates]

MS-B200 Spin Coater

Product Specifications

Maximum substrate size 8-inch-dia. wafers or 150 × 150 mm substrates
Rotational speed (rpm) 20 to 5,000
Rotational accuracy ±1 rpm (under load)
Motor AC servomotor
Cover Polycarbonate
Inside diameter of spinning chamber 360 mm dia.
Numbers of steps and patterns 100 steps × 10 patterns
Time setting 999.9 sec
Safety interlock Vacuum (included as standard)
Cover (included as standard)
Dripping equipment Optional
Working vacuum pressure -0.08 to -0.1 MPa
Power supply 100 to 240 V AC, 5 A
Outside dimensions (mm) 500 W × 335 H × 583 D
Weight 28 kg

Note: Specifications are subject to change without notice.

Coating Thickness Distribution Data

Coating Thickness Distribution Data

↑Click Zoom

Model used MS-B200
Coating thickness measurement system F50 (from Filmetrics)
Resist OFPR-800LB (from Tokyo Ohka Kogyo Co., Ltd.)
Substrate size 8-inch-dia. silicon wafers
Target coating thickness 1 μm
Coating thickness distribution ±0.5%
Contact us

MS-B300 Spin Coater

[Model suitable for 12-inch-dia. wafers and 200 × 200 mm substrates]

MS-B300 Spin Coater MS-B300 Spin Coater

Product Specifications

Maximum substrate size 12-inch-dia. wafers or 200 × 200 mm substrates
Rotational speed (rpm) 20 to 5,000
Rotational accuracy ±1 rpm (under load)
Motor AC servomotor
Cover Polycarbonate
Inside diameter of spinning chamber 500 mm dia.
Numbers of steps and patterns 100 steps × 10 patterns
Time setting 999.9 sec
Safety interlock Vacuum (included as standard)
Cover (included as standard)
Dripping equipment Optional (Up to two arms can be attached.)
Working vacuum pressure -0.08 to -0.1 MPa
Power supply 200 to 240 V AC, single-phase, 5 A
Outside dimensions (mm) 545 W × 432 H × 654 D
Weight 55 kg
Optional Centering jig

Note: Specifications are subject to change without notice.

Coating Thickness Distribution Data

Coating Thickness Distribution Data

↑Click Zoom

Model used MS-B300
Coating thickness measurement system F50 (from Filmetrics)
Resist OFPR-800LB (from Tokyo Ohka Kogyo Co., Ltd.)
Substrate size 12-inch-dia. silicon wafers
Target coating thickness 1 μm
Coating thickness distribution ±0.8%
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MS-B200 Spin Coater (Shield type)

[Shield model specifically designed for small square substrates]

MS-B200 Spin Coater (Shield type) MS-B200 Spin Coater (Shield type)

Product Specifications

Maximum substrate size 100 × 100 mm substrates
Rotational speed (rpm) 20 to 3,000
Rotational accuracy ±1 rpm (under load)
Motor AC servomotor
Sealing cover Aluminum and Delrin
Inside diameter of spinning chamber 360 mm dia.
Numbers of steps and patterns 100 steps × 10 patterns
Time setting 999.9 sec
Safety interlock Vacuum (included as standard)
Cover (included as standard)
Dripping equipment Cannot be attached.
Working vacuum pressure -0.08 to -0.1 MPa
Utility Air: 0.3 MPa (for upper cylinder)
Power supply 100 to 240 V AC, 5 A
Outside dimensions (mm) 540 W × 460 H × 630 D
Weight 44 kg

Note: Specifications are subject to change without notice.

Coating Thickness Distribution Data

MS-B200 (Shield type):Coating Thickness Distribution ±0.7%

↑Click Zoom

MS-B200 (Shield type):
Coating Thickness Distribution ±0.7%

MS-B200 (open type): Coating Thickness Distribution 19.6%

↑Click Zoom

MS-B200 (open type):
Coating Thickness Distribution 19.6%

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MS-B300 Spin Coater (Shield type)

[Shield model specifically designed for big square substrates]

MS-B300 Spin Coater (Shield type)

Product Specifications

Maximum substrate size 150 × 150 mm substrates
Rotational speed (rpm) 20 to 3,000
Rotational accuracy ±1 rpm (under load)
Motor AC servomotor
Sealing cover Aluminum and Delrin
Inside diameter of spinning chamber 500 mm dia.
Numbers of steps and patterns 100 steps × 10 patterns
Time setting 999.9 sec
Safety interlock Vacuum (included as standard)
Cover (included as standard)
Dripping equipment Optional (Only one arm can be attached.)
Working vacuum pressure -0.08 to -0.1 MPa
Utility Air: 0.3 MPa (for upper cylinder)
Power supply 200 to 240 V AC, single-phase, 5 A
Outside dimensions (mm) 570 W × 590 H × 650 D
Weight 65 kg

Note: Specifications are subject to change without notice.

Automatic dropping device attached example

≪Automatic dropping device attached example≫

Coating Thickness Distribution Data

Coating Thickness Distribution Data

↑Click Zoom

MS-B300 (Shield type):
Coating thickness distribution±0.7%

Coating Thickness Distribution Data

↑Click Zoom

MS-B300 (open type):
Coating thickness distribution±3.5%

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Sample Stages

At Photolithography.com, we offer standard sample stages for our spin coaters to suit your needs. Please feel free to contact us for customization services if you have other requirements.

●Sample Stages (standard) ●Sample Stages (customized)

For MS-B100
For MS-B150

 
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