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Product Information

Photolithography.com offers spin coaters, mask aligners, developing equipment, and etching equipment for laboratory applications.

Resist Coating images Exposure images Development images Etching
Developing Equipment for Photolithography AD-1200
AD-3000
Etching Equipment for Photolithography
ED-1200
ED-3000

Developing and Etching Equipment

Compact Developing Equipment for Photolithography / AD-1200

AD-1200

Features

  • ■ Capable of puddle development and spray development using a swing nozzle.
  • ■ Wetted parts are made of stainless steel to protect against chemicals.
  • ■ Easy programming using an LCD touchscreen.
  • ■ Expandable for up to three developer.
  • ■ Consecutive processing for feeding chemical rinsing, and spin drying.
  • ■ Incorporates a pressure pump for feeding chemical.

Product Specifications

ChamberMade of stainless steel
Substrate size1 to 6 in. dia. (150 × 150 mm)
Pumping of chemical solutionsPumped by a built-in pump.
Discharge of chemical solutionsSprayed out (via swing nozzle)
Number of steps 96 steps (with skip and copy functions)
Number of program modes 10 modes
Process (standard)Developer: one line
Rinse: one line
Backside rinse: one line
Developer usedAlkaline developers
Rotational speed0 to 3,000 rpm
InterlocksVacuum suction check sensor
Interlock for treatment chamber cover
Nozzle overrun limiter
Power supply100 V AC, 4 A
Dimensions (in mm, with the door open) 550 W × 440 H (740 H) × 400 D
Weight 33 kg
Main options Developer thermal management system (pressurization mode)
Substrate holders
Workbench on which the product is placed

Note: Specifications are subject to change without notice.

Comparison Images of Spray Development and Dip Development

Spray, 3 μm
Main Equipment and Materials
Resist AZ P4620
Developer AZ 400K
Spin coater used MS-B150
Mask aligner used MA-20
Developing equipment used AD-1200
Dip, 3 μm
Process Conditions
Substrate 4-inch-dia. silicon wafers
Primary treatment HMDS
Coating thickness >6μm
Prebake 100℃, 90 sec
Spray development time 60 sec

Note: Postbake was not performed.

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Developing Equipment for Photolithography / AD-3000

AD-3000

Features

  • ■ Twin swing nozzle spray suitable for large substrates.
  • ■ Wetted parts are made of stainless steel to protect against chemicals.
  • ■ Easy programming using an LCD touchscreen.
  • ■ Expandable to two or three lines of developer.
  • ■ Consecutive processing for feeding developer, rinsing, and spin drying.
  • ■ Developer are pumped by a pressure tank.

Product Specifications

ChamberMade of stainless steel
Substrate size1 to 12 in. dia. (220 × 220 mm)
Pumping of chemical solutionsPumped by a pressure tank.
Discharge of chemical solutionsSprayed out (via swing nozzle)
Number of steps 48 steps (with skip and copy functions)
Number of program modes 10 modes
Process (standard)Developer: one line (two nozzles)
Rinse: one line (two nozzles)
Backside rinse: one line
Developer usedAlkaline developers
Rotational speed0 to 3,000 rpm
InterlocksVacuum suction check sensor
Interlock for treatment chamber cover
Nozzle overrun limiter
Power supply200 V AC, three-phase, 15 A
UtilityN2:0.6MPa
Dimensions (in mm, with the door open) 720 W × 500 H (910 H) × 520D
Weight 60 kg
Main optionsDeveloper thermal management system (pressurization mode)
Substrate holders
Workbench on which the product is placed

Note: Specifications are subject to change without notice.

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Compact Etching Equipment for Photolithography / ED-1200

ED-1200

Features

  • ■ Spray etching equipment with a swing nozzle.
  • ■ Wetted parts are made of polyvinyl chloride (PVC) to protect against chemicals.
  • ■ Easy programming using an LCD touchscreen.
  • ■ Expandable for up to three etchant.
  • ■ Consecutive processing for etching, rinsing, and spin drying.
  • ■ Incorporates a pressure pump for feeding.

Product Specifications

ChamberMade of polyvinyl chloride (PVC)
Substrate size1 to 6 in. dia. (150 × 150 mm)
Pumping of chemical solutionsPumped by a built-in pump.
Discharge of chemical solutionsSprayed out (via swing nozzle)
Number of steps 96 steps (with skip and copy functions)
Number of program modes 10 modes
Process (standard)Etchant: one line
Rinse: one line
Backside rinse: one line
Etchant usedAcid etchant
Rotational speed0 to 3,000 rpm
InterlocksVacuum suction check sensor
Interlock for treatment chamber cover
Nozzle overrun limiter
Power supply100 V AC, 4 A
Dimensions (in mm, with the door open) 550 W × 440 H (740 H) × 400 D
Weight 33 kg
Main options Etchant thermal management system (pressurization mode)
Substrate holders
Workbench on which the product is placed
PTFE Chamber

Note: Specifications are subject to change without notice.

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Etching Equipment for Photolithography / ED-3000

ED-3000

Features

  • ■ Twin swing nozzle spray suitable for large substrates.
  • ■ Wetted parts are made of polyvinyl chloride (PVC) to protect against chemicals.
  • ■ Easy programming using an LCD touchscreen.
  • ■ Expandable to two or three lines of etchant.
  • ■ Consecutive processing for etching, rinsing, and spin drying.
  • ■ Etchant are pumped by a pressure tank.

Product Specifications

ChamberMade of polyvinyl chloride (PVC)
Substrate size1 to 12 in. dia. (220 × 220 mm)
Pumping of chemical solutionsPumped by a pressure tank.
Discharge of chemical solutionsSprayed out (via swing nozzle)
Number of steps 48 steps (with skip and copy functions)
Number of program modes 10 modes
Process (standard)Etchant: one line (two nozzles)
Rinse: one line (two nozzles)
Backside rinse: one line
Etchant usedAcid etchant
Rotational speed0 to 3,000 rpm
InterlocksVacuum suction check sensor
Interlock for treatment chamber cover
Nozzle overrun limiter
Power supply200 V AC, three-phase, 15 A
UtilityN2:0.6MPa
Dimensions (in mm, with the door open) 720 W × 500 H (910 H) × 520D
Weight 60 kg
Main optionsChemical solution temperature control system (pressurization mode)
Substrate holders
Workbench on which the product is placed
PTFE Chamber

Note: Specifications are subject to change without notice.

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