Product Information
Developing and Etching Equipment
Compact Developing Equipment for Photolithography / AD-1200
Features
- ■ Capable of puddle development and spray development using a swing nozzle.
- ■ Wetted parts are made of stainless steel to protect against chemicals.
- ■ Easy programming using an LCD touchscreen.
- ■ Expandable for up to three developer.
- ■ Consecutive processing for feeding chemical rinsing, and spin drying.
- ■ Incorporates a pressure pump for feeding chemical.
Product Specifications
| Chamber | Made of stainless steel |
|---|---|
| Substrate size | 1 to 6 in. dia. (150 × 150 mm) |
| Pumping of chemical solutions | Pumped by a built-in pump. |
| Discharge of chemical solutions | Sprayed out (via swing nozzle) |
| Number of steps | 96 steps (with skip and copy functions) |
| Number of program modes | 10 modes |
| Process (standard) | Developer: one line Rinse: one line Backside rinse: one line |
| Developer used | Alkaline developers |
| Rotational speed | 0 to 3,000 rpm |
| Interlocks | Vacuum suction check sensor Interlock for treatment chamber cover Nozzle overrun limiter |
| Power supply | 100 V AC, 4 A |
| Dimensions (in mm, with the door open) | 550 W × 440 H (740 H) × 400 D |
| Weight | 33 kg |
| Main options | Developer thermal management system (pressurization mode) Substrate holders Workbench on which the product is placed |
Note: Specifications are subject to change without notice.
Comparison Images of Spray Development and Dip Development
| Main Equipment and Materials | |
|---|---|
| Resist | AZ P4620 |
| Developer | AZ 400K |
| Spin coater used | MS-B150 |
| Mask aligner used | MA-20 |
| Developing equipment used | AD-1200 |
| Process Conditions | |
|---|---|
| Substrate | 4-inch-dia. silicon wafers |
| Primary treatment | HMDS |
| Coating thickness | >6μm |
| Prebake | 100℃, 90 sec |
| Spray development time | 60 sec |
Note: Postbake was not performed.
Developing Equipment for Photolithography / AD-3000
Features
- ■ Twin swing nozzle spray suitable for large substrates.
- ■ Wetted parts are made of stainless steel to protect against chemicals.
- ■ Easy programming using an LCD touchscreen.
- ■ Expandable to two or three lines of developer.
- ■ Consecutive processing for feeding developer, rinsing, and spin drying.
- ■ Developer are pumped by a pressure tank.
Product Specifications
| Chamber | Made of stainless steel |
|---|---|
| Substrate size | 1 to 12 in. dia. (220 × 220 mm) |
| Pumping of chemical solutions | Pumped by a pressure tank. |
| Discharge of chemical solutions | Sprayed out (via swing nozzle) |
| Number of steps | 48 steps (with skip and copy functions) |
| Number of program modes | 10 modes |
| Process (standard) | Developer: one line (two nozzles) Rinse: one line (two nozzles) Backside rinse: one line |
| Developer used | Alkaline developers |
| Rotational speed | 0 to 3,000 rpm |
| Interlocks | Vacuum suction check sensor Interlock for treatment chamber cover Nozzle overrun limiter |
| Power supply | 200 V AC, three-phase, 15 A |
| Utility | N2：0.6MPa |
| Dimensions (in mm, with the door open) | 720 W × 500 H (910 H) × 520D |
| Weight | 60 kg |
| Main options | Developer thermal management system (pressurization mode) Substrate holders Workbench on which the product is placed |
Note: Specifications are subject to change without notice.
Compact Etching Equipment for Photolithography / ED-1200
Features
- ■ Spray etching equipment with a swing nozzle.
- ■ Wetted parts are made of polyvinyl chloride (PVC) to protect against chemicals.
- ■ Easy programming using an LCD touchscreen.
- ■ Expandable for up to three etchant.
- ■ Consecutive processing for etching, rinsing, and spin drying.
- ■ Incorporates a pressure pump for feeding.
Product Specifications
| Chamber | Made of polyvinyl chloride (PVC) |
|---|---|
| Substrate size | 1 to 6 in. dia. (150 × 150 mm) |
| Pumping of chemical solutions | Pumped by a built-in pump. |
| Discharge of chemical solutions | Sprayed out (via swing nozzle) |
| Number of steps | 96 steps (with skip and copy functions) |
| Number of program modes | 10 modes |
| Process (standard) | Etchant: one line Rinse: one line Backside rinse: one line |
| Etchant used | Acid etchant |
| Rotational speed | 0 to 3,000 rpm |
| Interlocks | Vacuum suction check sensor Interlock for treatment chamber cover Nozzle overrun limiter |
| Power supply | 100 V AC, 4 A |
| Dimensions (in mm, with the door open) | 550 W × 440 H (740 H) × 400 D |
| Weight | 33 kg |
| Main options | Etchant thermal management system (pressurization mode) Substrate holders Workbench on which the product is placed PTFE Chamber |
Note: Specifications are subject to change without notice.
Etching Equipment for Photolithography / ED-3000
Features
- ■ Twin swing nozzle spray suitable for large substrates.
- ■ Wetted parts are made of polyvinyl chloride (PVC) to protect against chemicals.
- ■ Easy programming using an LCD touchscreen.
- ■ Expandable to two or three lines of etchant.
- ■ Consecutive processing for etching, rinsing, and spin drying.
- ■ Etchant are pumped by a pressure tank.
Product Specifications
| Chamber | Made of polyvinyl chloride (PVC) |
|---|---|
| Substrate size | 1 to 12 in. dia. (220 × 220 mm) |
| Pumping of chemical solutions | Pumped by a pressure tank. |
| Discharge of chemical solutions | Sprayed out (via swing nozzle) |
| Number of steps | 48 steps (with skip and copy functions) |
| Number of program modes | 10 modes |
| Process (standard) | Etchant: one line (two nozzles) Rinse: one line (two nozzles) Backside rinse: one line |
| Etchant used | Acid etchant |
| Rotational speed | 0 to 3,000 rpm |
| Interlocks | Vacuum suction check sensor Interlock for treatment chamber cover Nozzle overrun limiter |
| Power supply | 200 V AC, three-phase, 15 A |
| Utility | N2：0.6MPa |
| Dimensions (in mm, with the door open) | 720 W × 500 H (910 H) × 520D |
| Weight | 60 kg |
| Main options | Chemical solution temperature control system (pressurization mode) Substrate holders Workbench on which the product is placed PTFE Chamber |
Note: Specifications are subject to change without notice.
